EXCEL-2000 Direct Contact Temperature Forcing System
The premier thermodynamic benchmark engineered specifically for next-generation AI accelerators, ultra-high TDP server CPUs, GPUs, and hyperscale SOCs requiring continuous wattage thermal stability during extreme characterization and production burn-in.
Zero-Deflection Pneumatic Z-Clamping:
Micro-programmable contact downforce from 10 kg up to 180 kg with continuous load-cell closed loop feedback for delicate BGA & LGA ball preservation.
Direct Contact Head Umbilical:
3-meter flexible vacuum-insulated umbilical line delivering liquid conditioning directly onto high-mass thermal heads with zero condensation frost buildup.
Test Automation & ATE Handshake:
Native SCPI command over TCP/IP, GPIB (IEEE-488), USB, and custom Python/LabVIEW telemetry drivers designed for seamless Advantest, Teradyne, and NI integration.
Three Pillars of Dynamic Direct Thermal Forcing
Engineered to eliminate temperature lag in 2000W thermal dissipation environments where conventional air-stream chambers fail to arrest semiconductor thermal runaway.
Direct Contact Thermal Head & Z-Drive
Equipped with a solid-machined aerospace-grade aluminum/copper contact head housing high-sensitivity dual Class-A RTD sensors. Integrates calibrated pneumatic Z-stroke actuation with programmable contact downforce to ensure zero package bending while managing extreme thermal flux.
Dual-Stage Closed Cycle Thermodynamic Chiller
Proprietary closed-loop multi-circuit mechanical refrigeration system designed in Israel. Uses ozone-friendly environmentally certified refrigerants to continuously absorb 2000W of heat at sub-zero temperatures without requiring expensive liquid nitrogen (LN2) consumables.
Industrial HMI & Remote ATE Automation
Integrated high-resolution color touchscreen running calibrated EldroOS firmware. Real-time temperature ramp visualization, thermal profiling cycles, alarm overrides, dry purge gas monitors, and direct Ethernet SCPI control allowing 24/7 automated continuous multi-corner stress tests.
Benchtop vs. Mobile Chiller Tower
Select the mechanical configuration calibrated for your cleanroom facility constraints and testing station footprint.
EXCEL-2000 Tower
EXCEL-2000 Benchtop
Complete Engineering Specifications (EXCEL-2000)
Strict mechanical, thermodynamic, and programmatic specifications calibrated in Caesarea, Israel.
| Operational Parameter | Specification Metric | Testing Standard / Method |
|---|---|---|
| Temperature Range | -75°C to +170°C | Optional extended upper boundary to +225°C |
| Continuous DUT Dissipation Capacity | -35°C @ 2000W | 0°C @ 2200W | +25°C @ 2500W | Active copper direct-contact head calorimeter test |
| Thermal Head Temperature Stability | ±0.1°C steady state | Multi-point dual Class-A PT100 RTD sensors |
| Heating Ramp Rate | Up to 80°C / minute | Integrated ultra-fast response heater array |
| Cooling Ramp Rate | Up to 65°C / minute | High-volume thermodynamic expansion circuit |
| Clamping Force Control | 10 kg to 180 kg continuous programmable | Precision closed-loop load-cell pneumatic actuator |
| Supported Device Footprint | From 4x4 mm up to 100x100 mm packages | BGA, LGA, MCM, 2.5D/3D Chiplets, Bare Die |
| Purge Gas & Condensation Protection | Dry Air / Nitrogen purge chamber cap | Dew point suppression below -60°C |
| Umbilical Line Configuration | 3.0 Meter flexible insulated line | Reinforced braided jacket with counter-balance arm |
| Power Supply Requirement | 3-Phase 380V - 415V, 50/60 Hz, 32A | Industrial 5-pin CEE plug, internal line filter |
| Automation & Remote Software | Ethernet TCP/IP, GPIB, USB 2.0, RS-232 | SCPI native syntax, LabVIEW VI suite, Python API |
Tested Across Crucial Semiconductor Verticals
Where extreme power density and dynamic thermal spikes mandate sub-second temperature reaction times.
AI / HPC Accelerator Chips
Directly forced characterization for 1000W+ AI training GPUs, TPUs, and chiplet clusters experiencing brutal thermal ramp transients during matrix multiplication workloads.
Datacenter & Cloud CPUs
Multi-core server processors requiring strict junction temperature hold during ATE functional testing, clock speed grading, and maximum thermal design power stress.
Automotive ADAS & ECUs
AEC-Q100 Grade 0 / Grade 1 qualification cycling from sub-zero arctic starts (-40°C) to under-the-hood engine peak temps (+150°C) with precision transition speeds.
Aerospace & Defense Radars
GaN and GaAs RF front-end modules, radar transceiver units, and EW processors needing exact thermal stabilization during high pulsed-power duty cycles.
Modular Fixture Ecosystem
ELSYS Technologies manufactures customized package interface kits in India according to your DUT mechanical dimensions and socket footprint.
Custom Socket Adaptor Heads
CNC-machined contact pedestals engineered for high-pin count LGA3447, LGA4189, LGA4677, BGA2114, and proprietary multi-chip module sockets.
Zero pin scrub or PCB deformationCondensation Purge Chambers
Sealed dry-gas purging shrouds surrounding the socket perimeter to prevent frost formation and microscopic water bridge short-circuits during sub-zero thermal holds.
Continuous nitrogen / CDA purge feedBare Die Protective Buffers
Ultra-thin high thermal conductivity compliant interface foils and soft-landing load cells preventing micro-fractures on exposed silicon surfaces.
Calibrated for fragile 3D stacked diesConfigure Your EXCEL-2000 System
Submit your silicon thermal envelopes and test fixture parameters. Our Bangalore & Noida application engineers will deliver a customized thermal balance sheet, fixture design study, and formal quotation.